نتایج جستجو برای: Aspect ratio

تعداد نتایج: 588058  

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه صنعتی اصفهان 1368

پدیدهء انتقال حرارت جابجائی آزاد در حالت دائم از یک سیم افقی نازک آهنی در هوا، آب و روغن و در دماهای مختلف بطور تجربی بررسی شد. سیم آزمایش با اعمال جریان مستقیم (d.c.) گرم شده و با سیال اطراف خود در یک محفظه بزرگ تبادل حرارت می کرد. دمای سطح سیم آزمایش با محاسبه مقاومت آنکه خود بطور غیرمستقیم و با اندازه گیری ولتاژ و آمپراژ آن به دست می آمد، پیدا شد . برای ثبت اطلاعات و نتایج تا حد امکان از وسا...

1998
Ralf Diekmann Robert Preis Frank Schlimbach Chris Walshaw

This paper deals with the measure of Aspect Ratio for mesh partitioning and gives hints why, for certain solvers, the Aspect Ratio of partitions plays an important role. We define and rate different kinds of Aspect Ratio, present a new center-based partitioning method which optimizes this measure implicitly and rate several existing partitioning methods and tools under the criterion of Aspect R...

Journal: :international journal of advanced design and manufacturing technology 0
mohammadreza safaiy hamidreza goshayeshi

mixed convection is a fundamentally significant heat transfer mechanism that occurs in selection industrial and technological applications. in this study, first the laminar mixed convection inside rectangular enclosure with moving wall and aspect ratio=10 is modeled and then the results are compared with other investigate. after showing varity of results, the investigation is continued with tur...

2011
Mark de Berg Bettina Speckmann Vincent van der Weele

Treemaps are a popular technique to visualize hierarchical data. The input is a weighted tree T where the weight of each node is the sum of the weights of its children. A treemap for T is a hierarchical partition of a rectangle into simply connected regions, usually rectangles. Each region represents a node of T and its area is proportional to the weight of the corresponding node. An important ...

2013
Guillaume Iooss Sanjay Rajopadhye Christophe Alias Yun Zou

Parametric tiling is a well-known transformation which is widely used to improve locality, parallelism and granularity. However, parametric tiling is also a non-linear transformation and this prevents polyhedral analysis or further polyhedral transformation after parametric tiling. It is therefore generally applied during the code generation phase. In this paper, we present a method to remain p...

2005
Amitabh Chaudhary Michael T. Goodrich

Spatial databases support a variety of geometric queries on point data such as range searches, nearest neighbor searches, etc. Balanced Aspect Ratio (BAR) trees are hierarchical space decomposition structures that are general-purpose and space-efficient, and, in addition, enjoy a worst case performance poly-logarithmic in the number of points for approximate queries. They maintain limits on the...

2010
Ehsan Zhian Tabasy

1 PROBLEM 1 Based on [1], design equations for a saturated MOSFET using ACM model are given by: f D m T i I ng    1 1 2  (1) S D f I I i  (2) L W nC I T ox S. 2 2    (3)   1 1 2. 2 2    f T T i L f   (4)   4 1 1) (    f T SAT DS i V  (5) 1 1 1.    f T ox m i C g L W   (6) According to these equations, (W/L), f T , and power consumption can be plotted as a function of...

Journal: :Physical review fluids 2021

How iceberg shape affects melting is investigated in a combined experimental and numerical study of ice warm salt water. Experiments show that, contrast to previous models, highly nonuniform---side melt rates can be up 3 times larger than bottom rates, vary significantly within each face. Numerical simulations reveal that vortices accelerate at high flow speeds, double diffusive effects matter ...

Journal: :journal of nanostructures 2012
n. hajialigol g. a. sheikhzadeh m. ebrahim qomi a. fattahi

the fluid flow and heat transfer in lid-driven enclosures filled with cu-water nanofluid is numerically investigated. the moving vertical walls of the enclosure  are maintained in a constant temperature, while the horizontal walls are insulated. the hybrid scheme is used to discretize the convection terms and simpler algorithm is adopted to couple the velocity field and pressure in the momentum...

2006
Pradeep Dixit Jianmin Miao

Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...

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